How Can You Achieve Sub-Micron Copper Oxide Particle Size for Semiconductor Applications?

Our Turbo Mill TM-series utilizes innumerable high-speed vortex forces combined with cutting and impact mechanisms to produce ultra-fine copper oxide powders with particle sizes down to sub-micron levels. The controlled grinding environment prevents contamination while delivering the precise particle distribution required for semiconductor wafer processing and electronic paste formulations. Contact our technical team to discuss your specific particle size requirements and receive a customized grinding solution proposal with performance guarantees.

With over 70 years of manufacturing expertise, our copper oxide grinding solutions feature customized configurations for various production scales, from laboratory R&D units to high-capacity industrial systems. The complete processing line includes our TM-250 Applied Materials Grinding System for controlled size reduction, LK-series Vibro Separators for multi-layer screening up to 4 particle sizes, and integrated recycling systems for Eva, plastics, PCB, and IC board materials. Each system incorporates quick-change sieving mechanisms, contamination-free processing chambers, and energy-efficient operation to maximize productivity while meeting the exacting standards of semiconductor material suppliers, battery materials manufacturers, and advanced ceramic producers. Our turnkey solutions ensure consistent copper oxide powder quality, optimized particle distribution, and seamless integration into existing production workflows.